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Technology Update

June 2002
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A380 manufacture begins

An AT5X, described by Airbus as "the world's most advanced milling machine," is now in use by the company, with another unit undergoing installation as work gathers pace on the manufacture of the A380 airliner. Two lay-up machines for the production of carbon parts are now in operation, with three more scheduled to be introduced in March 2003. An infrared carbon-forming machine is also in use.

First metal for the A380 was cut early this year at various Airbus production sites around Europe. It was on January 23 that the machining of a "cross" and the production of carbon panels started simultaneously. The cross and the tee join the wing to the upper and lower parts of the center fuselage section and are key parts of the aircraft's structure within this section, explained Airbus. The use of carbon fiber in the aircraft will achieve significant mass savings.

Its center wing box (7 x 6 x 2 m) will consist of just over 50% carbon fiber, including forward and aft spars and upper and lower panels. The parts will be up to 4 cm thick. Airbus puts overall mass savings through the use of carbon fiber at more than 1000 kg.

- Stuart Birch


T-50 is prepared for first flight


Flight readiness reviews of the T-50 have been completed, paving the way to first flight, which is scheduled this month.

The T-50 Golden Eagle program has completed readiness review for its first flight, which is scheduled for this month. An executive independent review team, consisting of experts from the Korean Agency for Defense Development, the Defense Quality Assurance Agency, the Republic of Korea Air Force (ROKAF), the National Test Pilot School (Mojave, CA), and Lockheed Martin Aeronautics Co., concluded the series of flight readiness reviews in April.

Since its assembly in September, the first flight-test aircraft has been undergoing a series of ground tests to verify installed systems operations, including engine runs. In March, the static test aircraft completed limit load test requirements for the flight-test program. The next major steps to first flight are verification of onboard flight test instrumentation, final electromagnetic compatibility checks, and taxi testing.

Assembly of the second flight-test aircraft also has been completed, and the aircraft is undergoing ground systems checkouts. It was originally scheduled to fly at the end of this year, but might fly earlier than expected.

The T-50 Golden Eagle is a supersonic advanced jet trainer being developed by Korea Aerospace Industries (KAI) for the ROKAF. The T-50 will have the maneuverability, endurance, and advanced systems to prepare future pilots to fly current and next-generation fighters such as advanced F-16s, the F-22, and the Joint Strike Fighter. Lockheed Martin Aeronautics, the principal subcontractor to KAI, is providing technical expertise in all aspects of the program and is responsible for developing the T-50 avionics system, flight control system, and wings. The two companies are cooperatively marketing the T-50 internationally.

T-50 full-scale development, which began in 1997, is expected to continue through 2005. Initial production authorization is planned for the third quarter of 2003, with production deliveries to begin in 2005.

- Frank Bokulich


In pursuit of lead-free solder

Refining methods to develop lead-free solder technology for use in the aerospace industry is now a transatlantic aim. Recently, the first European and U.S. Lead-Free Solder Interface meeting was held in London. About 100 representatives of industry and research organizations attended the event, the aim of which was to exchange information about European Union and U.S. efforts to develop lead-free solder technology and to identify potential partnerships to provide solutions for lead-free technical needs.

According to the membership-based research and development organization Tin Technology, the continued use of tin-lead solder is presenting various risks to industries, including aerospace and defense, with current and future environmental legislation prohibiting lead-containing products and raising issues over component obsolescence and mission readiness. Tin Technology said the London meeting provided the opportunity for the EU and U.S. communities to meet and work together as a project team, with the aim of preparing two "joint test protocols" to help reduce the logistical and operational burden of lead-free introduction.

In Europe, the proposed EU Directives on Waste Electronic Equipment and Restriction of Hazardous Substances in Electronic Equipment are expected to ban lead from electronic solder applications in consumer, office, and IT goods by 2006.

- Stuart Birch


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