Electronics Packaging: Thermal & Mechanical Design and Analysis
I.D. # 97017 Duration 2 Days
Reliability issues can be avoided if engineers from various fields can develop a mutual understanding of the technical issues facing the design of an electronics package. This seminar enables engineers specializing in one area - electronics, packaging (structural and thermal integrity), thermal, vibration - to better understand and communicate with other engineers in this area of discipline.

The fields of thermal, vibration, and thermomechanical management are covered, with discussion on the relevance and applications of each field. Attendees will also receive a copy of the text "Practical Guide to the Packaging of Electronics", by the instructor, Ali Jamnia.

Learning Objectives
By attending this seminar, you will be able to:
  • Explain the fundamental engineering issues involved in electronics packaging
  • Define guidelines for a system's design - when the design criteria and components are not fully known
  • Identify reliability issues and concerns
  • Conduct more complete analyses for the final designs
  • Describe the delicate issues involved with electronics packaging and the interaction of various effects, and thus, fields of engineering
Who Should Attend
This course is intended for designers, mechanical and electrical engineers, project managers, engineering managers and/or Quality Assurance/Control managers who are, or will be, responsible for design or development of electronics systems. This workshop is developed from a system's point of view and is not intended to address the needs of a narrow and specialized field of engineering such as chip and encapsulation design or automotive microprocessor and harness packaging. An engineering undergraduate degree in any discipline would be beneficial.
Seminar Content

DAY ONE


Thermal Management
  • Issues in the Design of Electronics Packaging
    • Electronic
    • Thermal
    • Mechanical
    • Reliability
  • Basic Thermal Analysis and Heat Transfer Theory
    • Conduction, convection and radiation -- basic equations and concepts; navior stokes equations; table of nondimensional groups
  • Conduction Cooling
    • Thermal resistance
    • Comparison of some material properties
    • Contact interface resistance
    • Sample problem
  • Convection Cooling
    • Free convection -- laminar and turbulent flows; effects of altitude
    • Forced convection -- pressure drop; fanning friction; effects of altitude
  • Radiation Cooling
    • Emissivities
    • View factor calculations
  • Putting It All Together
    • Specifying the design constraints
    • Sample problem
  • Assignment
    • Specify the design constraints for a RF cabin
  • Fans, Fan Laws and Fan-Selection
  • Temperature and Reliability Issues

DAY TWO


Vibration Management

  • Vibration and Reliability Issues
  • Basics of Vibration
    • Oscillatory motion -- harmonic; periodic; vibration terminology
    • Free vibration -- Frequencies and mode shapes
    • Forced vibration
  • Random Vibration
  • Vibration Induced Stresses and Fatigue
    • Life expectancy calculations
  • Numerical Methods
    • Finite Element Methods
  • Assignment
    • Set up a simple vibration problem
    • Calculate the natural frequencies and mode shapes
    • Compare the results with analytical values
  • Thermomechanical Management
  • Thermal Cycling
  • Basics of Thermal Stress Calculations
    • Basic engineering equations
    • Some tips - effects of temperature on properties
  • Reliability Considerations
    • Fatigue and failure
  • Some Design tips on Various Materials
    • Plastics
    • Materials with a range of properties
  • Questions and Answers
Instructor(s): Ali Jamnia
Dr. Ali Jamnia is an independent electro-mechanical engineering design and product development consultant for the medical, automotive and telecommunications industries. His experience covers areas in computational solid mechanics, fluid dynamics and heat transfer. His career began as a lecturer for Clemson Univ. and shortly thereafter, as a consultant for Reliance Electric (working on residual thermal stress calculations). His tenure continued when he joined Ansys, Inc. to develop technical short courses and seminars. Later, he joined Fluid Dynamics as a research scientist to develop projects under contract to Benz in Germany, Westinghouse and NASA. At Airtronic Services, Inc. Dr. Jamnia worked in the capacity of Director of Engineering and Research and focused his attention to developing products for the medical field. In his capacity as a program manager and later as a senior mechanical engineer at De Amertek Corporation, he developed several products for automotive industries. To this end, he has applied for four patents in 2004. He received his Ph.D. from Clemson University where his primary area of research was application of finite element methods to the hydrodynamic equations in the presence of shock waves and nonlinear fluid-solid interaction.
Testimonial
"This was a good course with excellent practical methods to design electrical packages."
Bruce Lucas
Technical Professional
Halliburton Energy Services

Fees: $1355 SAE Members*: $1084 - $1220
* The appropriate SAE Member discount will be applied through the Registration process.  Discounts vary according to level of membership: Elite Member 20%; Premium Member 15%; Classic Member 10%
CEU 1.3