Journalists Invited to Attend SAE 2016 Commercial Vehicle Engineering Congress – October 4-6 in Rosemont, Ill.
WARRENDALE, Pa., Sept. 19, 2016 - Journalists and other credentialed media are invited to attend the SAE 2016 Commercial Vehicle Engineering Congress (COMVEC), which will be held Oct. 4-6, 2016, at the Donald E. Stephens Convention Center in Rosemont, Ill.
Daimler will provide Executive Leadership for the event.
The three-day event will feature a theme of “Connectivity” and will showcase pilot programs for a potential new event format to be launched in 2017. These pilots include two symposia – one on “Autonomous Commercial Vehicles, Promises and Challenges” and the other on “Meeting the Challenges of Phase 2 GHG: Implications and Effects.”
Roger Nielsen, Chief Operating Officer for Daimler Trucks North America LLC (DTNA) will be the Keynote Speaker.
COMVEC 2016 will also feature Executive Panel Discussions with four different moderated groups covering the topics of Telematics, Commercial Vehicles and the Industrial Internet of Things (IIOT), Connectivity from the Customer Perspective, and the connected future of mobility. The most up to date information about keynote speakers, panel discussions, technical sessions, integrated technical displays, along with information for the two Symposia pilots can be found on the SAE International website at http://www.sae.org/events/cve/.
To request press credentials, email email@example.com or call 1-724-772-8522.
SAE International is a global association committed to being the ultimate knowledge source for the engineering profession. By uniting over 127,000 engineers and technical experts, we drive knowledge and expertise across a broad spectrum of industries. We act on two priorities: encouraging a lifetime of learning for mobility engineering professionals and setting the standards for industry engineering. We strive for a better world through the work of our charitable arm, the SAE Foundation, which helps fund programs like A World in Motion® and the Collegiate Design Series™.
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