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The current automotive electronic and electrical (EE) architecture has reached a scalability limit and in order to adapt to the new and upcoming requirements, novel automotive EE architectures are currently being investigated to support: a) an Ethernet backbone, b) consolidation of hardware capabilities leading to a centralized architecture from an existing distributed architecture, c) optimization of wiring to reduce cost, and d) adaptation of service-oriented software architectures. These requirements lead to the development of Zonal EE architectures as a possible solution that require appropriate adaptation of used security mechanisms and the corresponding utilized hardware trust anchors. 1 The current architecture approaches (ECU internal and in-vehicle networking) are being pushed to their limits, simultaneously, the current embedded security solutions also seem to reveal their limitations due to an increase in connectivity.

The reduction of vehicle exhaust particle emissions is a success story of European legislation. Various particle number (PN) counters and calibration procedures serve as tools to enforce PN emission limits during vehicle type approval (VTA) or periodical technical inspection (PTI) of in-use vehicles. Although all devices and procedures apply to the same PN-metric, they were developed for different purposes, by different stakeholder groups and for different target costs and technical scopes. Furthermore, their calibration procedures were independently defined by different stakeholder communities. This frequently leads to comparability and interpretation issues. Systematic differences of stationary and mobile PN counters (PN-PEMS) are well-documented. New, low-cost PTI PN counters will aggravate this problem. Today, tools to directly compare different instruments are scarce.

This paper describes a novel approach for modeling an automotive HVAC unit. The model consists of black-box models trained with experimental data from a self-developed measurement setup. It is capable of predicting the temperature and mass flow of the air entering the vehicle cabin at the various air vents. A combination of temperature and velocity sensors is the basis of the measurement setup. A measurement fault analysis is conducted to validate the accuracy of the measurement system. As the data collection is done under fluctuating ambient conditions, a review of the impact of various ambient conditions on the HVAC unit is performed. Correction models that account for the different ambient conditions incorporate these results. Numerous types of black-box models are compared to identify the best-suited type for this approach. Moreover, the accuracy of the model is validated using test drive data.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.

Over the past decades, interior noise from wind noise or engine noise have been significantly reduced by leveraging improvements of both the overall vehicle design and of sound package. Consequently, noise sources originating from HVAC systems (Heat Ventilation and Air Conditioning), fans or exhaust systems are becoming more relevant for perceived quality and passenger comfort. This study focuses on HVAC systems and discusses a Flow-Induced Noise Detection Contributions (FIND Contributions) numerical method enabling the identification of the flow-induced noise sources inside and around HVAC systems. This methodology is based on the post-processing of unsteady flow results obtained using Lattice Boltzmann based Method (LBM) Computational Fluid Dynamics (CFD) simulations combined with LBM-simulated Acoustic Transfer Functions (ATF) between the position of the sources inside the system and the passenger’s ears.

Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

Vehicle manufacturers are challenged by rising costs for vehicle recalls. A major part of the costs are caused by software updates. This paper describes a feasibility study on how to implement software update over the air (SOTA) in light vehicles. The differences and special challenges in the automotive environment in comparison to the cellular industry will be explained. Three key requirements focus on the drivers’ acceptance and thus are crucial for the vehicle manufacturers: SOTA must be protected against malicious attacks. SOTA shall interfere as little as possible with the availability of a vehicle. Long update processes with long vehicle downtimes or even complete fails must be avoided. The functional safety of the vehicle during operation may not be limited in any way The study gives options how those objectives can be achieved. It considers the necessary security measures and describes the required adaptations of the board-net architectures both on software and hardware level.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

Timing evaluation methods help to design a robust and extendible E/E architecture (electric/electronic). BMW has introduced the systematic application of such methods in the E/E design process within the last three years. Meanwhile, most of the architectural changes are now verified by a tool-based, automatic real-time analysis. This has increased the accuracy of the network planning and productivity of the BMW network department. In this paper, we give an overview of the actual status of timing evaluations in BMW's E/E architecture design. We discuss acceptance criteria, analysis metrics, and design rules, as far as these are related to timing. We look specifically at automation options, as these improve the productivity further. We will see that timing analysis has matured and should be mandatory for application in mass production E/E architecture development. At the same time, there is room for future improvements.

Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.

The potential to reduce the cost of embedded software by standardizing the application behavior for Automotive Body and Comfort domain functions is explored in this paper. AUTOSAR, with its layered architecture and a standard definition of the interfaces for Body and Comfort application functions, has simplified the exchangeability of software components. A further step is to standardize the application behavior, by developing standard specifications for common Body and Comfort functions. The corresponding software components can be freely exchanged between different OEM/Tier-1 users, even if developed independently by multiple suppliers. In practice, individual OEM users may need to maintain some distinction in the functionality. A method of categorizing the specifications as ‘common’ and ‘unique’, and to configure them for individual applications is proposed. This allows feature variability by means of relatively simple adapter functions.

Nowadays, a continually growing system complexity due to the development of an increasing number of vehicle concepts in a steadily decreasing development time forces the engineering departments in the automotive industry to a deepened system understanding. The virtual design and validation of individual components from subsystems up to full vehicles becomes an even more significant role. As an answer to the challenge of reducing complete hardware prototypes, the virtual competence in NVH, among other methods, has been improved significantly in the last years. At first, the virtual design and validation of objectified phenomena in analogy to hardware tests via standardized test rigs, e.g. four poster test rig, have been conceived and validated with the so called MBS (Multi Body Systems).

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

The BMW Group has introduced electric cars to the market with the MINI E already in 2009. The next step will be the launch of the BMW ActiveE in 2011, followed by the revolutionary Mega City Vehicle in 2013. The presentation will explain the BMW Group strategy for implementing sustainable mobility. A focus will be emobility, the use of carbon fiber and the holistic sustainability approach of BMW Group?s project i. Reference will be made to the research results of the MINI E projects in the US and in Europe. Presenter Andreas Klugescheid, BMW AG

In addition to basic switching functionality, smart power switches mainly provide diagnostic and protection functions, e.g. for short circuits to the load, which makes it all the more surprising that short circuit protected smart switches have been used for years in automotive applications without there being a precise definition of a short circuit. This article describes what Infineon has done to fill this gap. It was first necessary to define the kind of short circuits likely to occur in automotive applications and to specify the use and operating points of the smart switches. The next logical step was the standardization of the test circuit and application conditions in the AEC (Automotive Electronics Council) to allow an industry-wide comparison of the test results.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).