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The technology in the automotive industry is evolving rapidly in recent times. Thus, with the development of new technologies, the challenges are also ever-increasing from an Electromagnetic Interference and Susceptibility (EMI/EMC) perspective. A lot of the latest technologies in Adaptive Driver Assistance Systems (ADAS), which include Rear Drive Assist, Blind Spot Detection (BSD), Lane Change Assist (LCA) to name a few, and other features like Anti-Braking System (ABS), Emergency Brake Assist (EBD) etc. rely heavily on different types of sensors and their detection circuitry. In addition, a lot of other internal functions in the Engine Control Unit (ECU) also depend on such sensors’ functionalities. Thus, it becomes imperative to study the potential impact of higher field emissions on the immunity behaviour of the sensors.

The current automotive electronic and electrical (EE) architecture has reached a scalability limit and in order to adapt to the new and upcoming requirements, novel automotive EE architectures are currently being investigated to support: a) an Ethernet backbone, b) consolidation of hardware capabilities leading to a centralized architecture from an existing distributed architecture, c) optimization of wiring to reduce cost, and d) adaptation of service-oriented software architectures. These requirements lead to the development of Zonal EE architectures as a possible solution that require appropriate adaptation of used security mechanisms and the corresponding utilized hardware trust anchors. 1 The current architecture approaches (ECU internal and in-vehicle networking) are being pushed to their limits, simultaneously, the current embedded security solutions also seem to reveal their limitations due to an increase in connectivity.

The reduction of vehicle exhaust particle emissions is a success story of European legislation. Various particle number (PN) counters and calibration procedures serve as tools to enforce PN emission limits during vehicle type approval (VTA) or periodical technical inspection (PTI) of in-use vehicles. Although all devices and procedures apply to the same PN-metric, they were developed for different purposes, by different stakeholder groups and for different target costs and technical scopes. Furthermore, their calibration procedures were independently defined by different stakeholder communities. This frequently leads to comparability and interpretation issues. Systematic differences of stationary and mobile PN counters (PN-PEMS) are well-documented. New, low-cost PTI PN counters will aggravate this problem. Today, tools to directly compare different instruments are scarce.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

A cooperation of several research partners supported by the German Federal Ministry of Research and Education proposes a new active matrix LED light source. A multi pixel flip chip LED array is directly mounted to an active driver IC. A total of 1024 pixel can be individually addressed through a serial data bus. Several of these units are integrated in a prototype headlamp to enable advanced light distribution patterns in an evaluation vehicle.

Vehicle manufacturers are challenged by rising costs for vehicle recalls. A major part of the costs are caused by software updates. This paper describes a feasibility study on how to implement software update over the air (SOTA) in light vehicles. The differences and special challenges in the automotive environment in comparison to the cellular industry will be explained. Three key requirements focus on the drivers’ acceptance and thus are crucial for the vehicle manufacturers: SOTA must be protected against malicious attacks. SOTA shall interfere as little as possible with the availability of a vehicle. Long update processes with long vehicle downtimes or even complete fails must be avoided. The functional safety of the vehicle during operation may not be limited in any way The study gives options how those objectives can be achieved. It considers the necessary security measures and describes the required adaptations of the board-net architectures both on software and hardware level.

The trend towards even more sophisticated driver assistance systems and growing automation of driving sets new requirements for the robustness and availability of the involved automotive systems. In case of an error, today it is still sufficient that safety related systems just fail safe or silent to prevent safety related influence of the driving stability resulting in a functional deactivation. But the reliance on passive mechanical fallbacks in which the human driver taking over control, being inevitable in such a scenario, is expected to get more and more insufficient along with a rising degree of driving automation as the driver will be given longer reaction time. The advantage of highly or even fully automated driving is that the driver can focus on other tasks than controlling the car and monitoring it’s behavior and environment.

In-vehicle communication faces increasing bandwidth demands, which can no longer be met by today's MOST150, FlexRay or CAN networks. In recent years, Fast Ethernet has gained a lot of momentum in the automotive world, because it promises to bridge the bandwidth gap. A first step in this direction is the introduction of Ethernet as an On Board Diagnostic (OBD) interface for production vehicles. The next potential use cases include the use of Ethernet in Driver Assistance Systems and in the infotainment domain. However, for many of these use cases, the Fast Ethernet solution is too slow to move the huge amount of data between the Domain Controllers, ADAS Systems, Safety Computer and Chassis Controller in an adequate way. The result is the urgent need for a network technology beyond the Fast Ethernet solution. The question is: which innovation will provide enough bandwidth for domain controllers, fast flashing routines, video data, MOST-replacement and internal ECU buses?

It has become an important trend to implement safety-related requirements in the road vehicles. Recent studies have shown that accidents, which occurred when drivers are not focused due to fatigue or distractions, can be predicted in advance when using safety features. Advanced Driver Assistance Systems (ADAS) are used to prevent this kind of situation. Currently, many major tiers are using a DSP chip for ADAS applications. This paper suggests the migration from a DSP configuration to a Microcontroller configuration for ADAS application, for example, using a 32bit Multi-core Microcontroller. In this paper, the following topics will be discussed. Firstly, this paper proposes and describes the system block diagram for ADAS configuration followed by the requirements of the ADAS system. Secondly, the paper discusses the current solutions using a DSP. Thirdly, the paper presents a system that is migrated to a Multi-core microcontroller.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.

The potential to reduce the cost of embedded software by standardizing the application behavior for Automotive Body and Comfort domain functions is explored in this paper. AUTOSAR, with its layered architecture and a standard definition of the interfaces for Body and Comfort application functions, has simplified the exchangeability of software components. A further step is to standardize the application behavior, by developing standard specifications for common Body and Comfort functions. The corresponding software components can be freely exchanged between different OEM/Tier-1 users, even if developed independently by multiple suppliers. In practice, individual OEM users may need to maintain some distinction in the functionality. A method of categorizing the specifications as ‘common’ and ‘unique’, and to configure them for individual applications is proposed. This allows feature variability by means of relatively simple adapter functions.

ISO 26262 is the actual standard for Functional Safety of automotive E/E (Electric/Electronic) systems. One of the challenges in the application of the standard is the distribution of safety related activities among the participants in the supply chain. In this paper, the concept of a Safety Element out of Context (SEooC) development will be analyzed showing its current problematic aspects and difficulties in implementing such an approach in a concrete typical automotive development flow with different participants (e.g. from OEM, tier 1 to semiconductor supplier) in the supply chain. The discussed aspects focus on the functional safety requirements of generic hardware and software development across the supply chain where the final integration of the developed element is not known at design time and therefore an assumption based mechanism shall be used.

Trans Tech recently debuted the all-electric eTrans school bus providing a total zero emission school bus. The presentation will demonstrate Smith Electric Vehicles and their history with electric vehicles. The presentation will help ensure that everybody has an idea of what the electric school bus will do and to dispel any rumors about the vehicle. Presenter Brian S. Barrington, Trans Tech. Bus

The BMW Group has introduced electric cars to the market with the MINI E already in 2009. The next step will be the launch of the BMW ActiveE in 2011, followed by the revolutionary Mega City Vehicle in 2013. The presentation will explain the BMW Group strategy for implementing sustainable mobility. A focus will be emobility, the use of carbon fiber and the holistic sustainability approach of BMW Group?s project i. Reference will be made to the research results of the MINI E projects in the US and in Europe. Presenter Andreas Klugescheid, BMW AG

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers with incredible levels of peripheral integration. As a result, performance can no longer be measured in MIPS (Millions of Instructions Per Second). A microcontroller's effectiveness is based on coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, the designer needs benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment.

More than ever, microcontroller performance in cars has a direct impact on the driving experience, on compliance with improved safety, ever-stricter emissions regulations, and on fuel economy. The simple microcontrollers formerly used in automobiles are now being replaced by powerful number-crunchers whose performance can no longer be measured in MIPS. Instead, their effectiveness is based on a coherent partitioning between analog and digital, hardware and software, tools and methodology. To make an informed choice among the available devices, what the designer needs are benchmarks that are specific to automotive applications, and which provide a realistic representation of how the device will perform in the automotive environment. This presentation will explore the role of new benchmarks in the development of complex automotive applications.

The signal delivery and quality of sensor data is of growing importance for modern automotive control applications. Sensors tend to be calibrated subsystems that are designed to stay in a defined tolerance and thus can easily be modeled. Compared to this deterministic behavior the transmission channel is time variant due to EMC and aging of contacts for example. The use of analog signaling, which is the actual state of realization in many cases, is sensitive to the time variant effects mentioned before. This time variance is hard to consider for the control system development. In this paper we will analyze the role of the sensor in the signal supply chain and discuss approaches for digital sensor-ECU communication and their potential to establish a link, which allows neglecting low level effects of the channel.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.