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In this paper, we address the thermal management issues which limit the lifespan, specific power and overall efficiency of an air-cooled rotary Wankel engine used in Unmanned Air Vehicles (UAVs). Our goal is to eliminate the hot spots and reduce the temperature gradients in the engine housing and side plates by aggressive heat spreading using heat pipes. We demonstrate by simulation that, for a specific power requirement, with heat spreading and more effective heat dissipation, thermal stress and distortion can be significantly reduced, even with air cooling. The maximum temperature drop was substantial, from 231°C to 129°C. The temperature difference (measure of temperature uniformity) decreased by 8.8 times (from 159°C to 18°C) for a typical UAV engine. Our heat spreaders would not change the frontal area of the engine and should have a negligible impact on the installed weight of the propulsion assembly.

This paper presents the concept of a dual latent heat sink for thermal management of pulse heat generating electronic systems. The focus of this work is to verify the effectiveness of the concept during charging through experimentation. Accordingly, custom components were built and a prototype version of the heat sink was fabricated. Experiments were performed to investigate the implementation feasibility and heat transfer performance. It is shown that this heat sink is practicable and helps in arresting the system temperature rise during charging (period of pulse heat load).

A power electronics module was equipped with an evaporative spray cooling nozzle assembly that served to remove waste heat from the silicon devices. The spray cooling nozzle assembly took the place of the standard heat sink, which uses single phase convection. The purpose of this work was to test the ability of spray cooling to enable higher power density in power electronics with high temperature coolant, and to be an effective and lightweight system level solution to the thermal management needs of aerospace vehicles. The spray cooling work done here was with 95 °C water, and this data is compared to 100 °C water/ propylene glycol spray cooling data from a previous paper so as to compare the spray cooling performance of a single component liquid to that of a binary liquid such as WPG. The module used during this work was a COTS module manufactured by Semikron, Inc., with a maximum DC power input of 180 kW (450 VDC and 400 A).

Effective thermal management and removal of the waste heat generated at diode arrays is critical to the development of high-power solid-state lasers. Thermal design must be considered in the packaging of these arrays. Two different packages with heat dissipation through spray cooling are evaluated experimentally and numerically. Their overall performance is compared with other packaging configurations using different heat removal approaches. A novel packaging design is proposed that can fulfill the requirements of low thermal resistance, temperature uniformity among emitters in the diode array, low coolant flow rate, simplicity and low assembly cost. The effect of temperature uniformity on the pumping efficiency for gain media is examined for our novel packaging design. The thermal stress induced by temperature variation within an emitter is also considered.