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Technical Paper

Thermo-Mechanical Reliability of Nano-Silver Sintered Joints versus Lead-Free Solder Joints for Attaching Large-Area Silicon Devices

2010-11-02
2010-01-1728
Nano-silver sintered bonding was carried out at 275°C and under 3MPa pressures, and soldering in a vacuum reflowing oven to reduce voiding. Both joints are subject to large shear stresses due to the mismatch in coefficients of thermal expansion (CTE) between the chip and the substrate. In this study, residual stresses in the chip-on-substrate assemblies were determined by measuring the bending curvatures of the bonded structures. An in-house optical setup measured the bending curvatures using a thin-film stress measurement technique. From the measured bending curvatures and the mechanical properties of the constituent materials, residual stresses were calculated. The thermo-mechanical reliabilities of both joining techniques were tested by thermal cycling. The chip assemblies were cycled between -40°C and 125°C (100 minutes of cycle time, 10 minutes of dwell time) and the changes in their bending curvatures were measured.
Technical Paper

Optimized Design Procedure for Active Power Converters in Aircraft Electrical Power Systems

2016-09-20
2016-01-1989
In modern aircraft power systems, active power converters are promising replacements for transformer rectifier units concerning efficiency and weight. To assess the benefits of active power converters, converter design and optimization should be carefully done under the operation requirements of aircraft applications: electromagnetic interference (EMI) standards, power quality standards, etc. Moreover, certain applications may have strict limits on other converter specifications: weight, size, converter loss, etc. This paper presents the methodology for performance optimization of different active power converters (active front-ends, isolated DC/DC converters and three-phase isolated converters) for aircraft applications. Key methods for power converter component (e.g. inductors, semiconductor devices, etc.) performance optimization and loss calculation are introduced along with the converter optimization procedure.
Technical Paper

Reheating and Sterilization Technology for Food, Waste and Water: Design and Development Considerations for Package and Enclosure

2005-07-11
2005-01-2926
Long-duration space missions require high-quality, nutritious foods, which will need reheating to serving temperature, or sterilization on an evolved planetary base. The package is generally considered to pose a disposal problem after use. We are in the process of development of a dual-use package wherein the food may be rapidly reheated in situ using the technology of ohmic heating. We plan to make the container reusable, so that after food consumption, the package is reused to contain and sterilize waste. This approach will reduce Equivalent System Mass (ESM) by using a compact heating technology, and reducing mass requirements for waste storage. Preliminary tests of the package within a specially-designed ohmic heating enclosure show that ISS menu item could easily be heated using ohmic heating technology. Mathematical models for heat transfer were used to optimize the layout of electrodes to ensure uniform heating of the material within the package.
Technical Paper

Enhanced Low-Order Model with Radiation for Total Temperature Probe Analysis and Design

2017-09-19
2017-01-2047
Analysis and design of total temperature probes for accurate measurements in hot, high-speed flows remains a topic of great interest in aerospace propulsion and a number of other engineering areas. Despite an extensive prior literature on the subject, prediction of error sources from convection, conduction and radiation is still an area of great concern. For hot-flow conditions, the probe is normally mounted in a cooled support, leading to substantial axial conduction along the length of the probe. Also, radiation plays a very important role in most hot, high-speed conditions. One can apply detailed computational methods for simultaneous convection, conduction and radiation heat transfer, but such approaches are not suitable for rapid, routine analysis and design studies. So, there is still a place for low-order approximate methods, and that is the subject of this paper.
Technical Paper

Verification, Validation and Uncertainty Quantification (VV&UQ) Framework Applicable to Power Electronics Systems

2014-09-16
2014-01-2176
The development of the concepts, terminology and methodology of verification and validation is based on practical issues, not the philosophy of science. Different communities have tried to improve the existing terminology to one which is more comprehensible in their own field of study. All definitions follow the same concept, but they have been defined in a way to be most applicable to a specific field of study. This paper proposes the Verification, Validation, and Uncertainty Quantification (VV&UQ) framework applicable to power electronic systems. Although the steps are similar to the VV&UQ frameworks' steps from other societies, this framework is more efficient as a result of the new arrangement of the steps which makes this procedure more comprehensible. This new arrangement gives this procedure the capability of improving the model in the most efficient way.
Technical Paper

Development of a Multi-Disciplinary Optimization Framework for Nonconventional Aircraft Configurations in PACELAB APD

2015-09-15
2015-01-2564
1 Most traditional methods and equations for estimating the structural and nonstructural weights and aerodynamics used at the aircraft conceptual design phase are empirical relations developed for conventional tube-and-wing aircraft. In a computation-heavy design process, such as Multidisciplinary Design and Optimization (MDO) simplicity of calculation is paramount, and for conventional configurations the aforementioned approaches work well enough for conceptual design. But, for non-traditional designs such as strut-braced winged aircraft, empirical data is generally not available and the usual methods can no longer apply. One solution to this is a movement toward generalized physics-based methods that can apply equally well to conventional or non-traditional configurations.
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