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Seven encapsulants with operating temperatures up to 250°C were surveyed for use in planar packages for wide-bandgap dice. Two of the encapsulants failed processability test because they were not able to flow, and another two failed because they induced voids or cracks after curing. The dielectric results of the remaining three encapsulants showed that both dielectric strength and permittivity decreased almost 40% when the temperature was increased up to 250°C. As the three encapsulants were used to encapsulate a power module, it was proven that all of them could protect the package from early breakdown caused by the poor dielectric strength of air.

The development of the concepts, terminology and methodology of verification and validation is based on practical issues, not the philosophy of science. Different communities have tried to improve the existing terminology to one which is more comprehensible in their own field of study. All definitions follow the same concept, but they have been defined in a way to be most applicable to a specific field of study. This paper proposes the Verification, Validation, and Uncertainty Quantification (VV&UQ) framework applicable to power electronic systems. Although the steps are similar to the VV&UQ frameworks' steps from other societies, this framework is more efficient as a result of the new arrangement of the steps which makes this procedure more comprehensible. This new arrangement gives this procedure the capability of improving the model in the most efficient way.