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This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This document applies to the development of Plans for integrating and managing electronic components in equipment for the military and commercial aerospace markets; as well as other ADHP markets that wish to use this document. Examples of electronic components, as described in this document, include resistors, capacitors, diodes, integrated circuits, hybrids, application specific integrated circuits, wound components, and relays. It is critical for the Plan owner to review and understand the design, materials, configuration control, and qualification methods of all “as-received” electronic components, and their capabilities with respect to the application; identify risks, and where necessary, take additional action to mitigate the risks. The technical requirements are in Clause 3 of this standard, and the administrative requirements are in Clause 4.

This document applies to the development of plans for the integration and management of COTS assemblies in electronic systems used in the commercial, military and space markets. COTS assemblies include items such as VPX circuit cards/modules (single board computers, etc.), servers, printers, laptop computers, printed wiring assemblies, disk drives, etc. This publication is not intended to preclude or discourage other approaches that similarly represent good engineering practice, or that may be acceptable to, or have been accepted by, appropriate bodies. Parties who wish to bring other approaches to the attention of the formulating committee to be considered for inclusion in future drafts of this publication are encouraged to do so. It is the intention of the formulating committee to revise and update this publication from time to time as may be occasioned by changes in technology, industry practice, or government regulations, or for other appropriate reasons.