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This document contains a list of EVI tests that can be specified by the Requester to detect Suspect/Counterfeit EEE Parts. The following EVI tests described in this document are listed in 3.4 of AS6171 General Requirements: Method A: General EVI Method B: Detailed EVI, including Part Weight Measurement Method C: Testing for Remarking Method D: Testing for Resurfacing Method E: Part Dimensions Measurement When the SOW or the PO includes Part Packaging test(s) (refer to AS6171/15), the Responsible Test Laboratory (RTL) shall ensure that the Part Packaging test(s) are completed prior to starting the EVI test(s). This document is focused on EEE parts (herein may be referred to as “EEE parts” or “parts”). Although the examples in this document focus on microcircuits, this document applies to all EEE parts listed in the Applicability Matrix (Appendix A of AS6171 General Requirements).

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General EVI, Sample Selection, and Handling b Method B: Detailed EVI, including Part Weight measurement c Method C: Testing for Remarking d Method D: Testing for Resurfacing e Method E: Part Dimensions measurement f Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.