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The C166 family, based on a 16-bit core; it is nowadays an enormous success in automotive, in particular in PowerTrain. This component is the right answer for the automotive real time applications of today. It is with both, automotive customer requirements and a long automotive experience in semi-conductors that this new generation 32-bit family is borne. The objective of this document is to provide and comment on automotive requirements in terms of the new micro-controller, to show the benefits for the applications and explain how the AUDO architecture fulfils these requirements.

The technology in the automotive industry is evolving rapidly in recent times. Thus, with the development of new technologies, the challenges are also ever-increasing from an Electromagnetic Interference and Susceptibility (EMI/EMC) perspective. A lot of the latest technologies in Adaptive Driver Assistance Systems (ADAS), which include Rear Drive Assist, Blind Spot Detection (BSD), Lane Change Assist (LCA) to name a few, and other features like Anti-Braking System (ABS), Emergency Brake Assist (EBD) etc. rely heavily on different types of sensors and their detection circuitry. In addition, a lot of other internal functions in the Engine Control Unit (ECU) also depend on such sensors’ functionalities. Thus, it becomes imperative to study the potential impact of higher field emissions on the immunity behaviour of the sensors.

The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems push the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration pass to evolution and even revolution of automotive Sensors and Sensor interfaces. The document will explore different architectures and partitioning. Sensor technologies such as magnetic field sensors based on the hall effect as well as bulk and surface silicon micro machined sensors will be mapped to automotive applications by examples. Functions such as self-test, self-calibration and self-repair will be developed.

As the demand for enhanced comfort, safety and differentiation with new features continues to grow and as electronics and software enable most of these, the number of electronic units or components within automobiles will continue to increase. This will increase the overall system complexity, specifically with respect to the number of controller actuators such as e-motors. However, hard constraints on cost and on physical boundaries such as maximum power dissipation per unit and pin-count per unit/connector require new solutions to alternative system partitioning. Vehicle manufacturers, as well as system and semiconductor suppliers are striving for increased scalability and modularity to allow for most cost optimal high volume configurations while featuring platform reuse and feature differentiation. This paper presents new semiconductor based approaches with respect to technologies, technology mapping and assembly technologies.

In the case of a side impact the decision to deploy an airbag has to be taken much faster as it would be required for a front impact. Furthermore, there is a significant spread of the measurable acceleration depending on which pillars of the cars side are hit. Measuring the pressure inside the door as a direct result of an impact, the deformation of the door becomes observable. Based on pressure measurements side impacts can be detected much faster and more reliable. Therefore side airbag pressure sensors are established as add-on or replacement for side airbag acceleration sensors. This paper will present a Side Airbag Chip Set comprising of a side airbag pressure sensor and a satellite receiver. The system architecture and the partitioning between a single chip solution for the side airbag pressure sensor module plus the compatible satellite receiver will be described.

Driven by the growing internet and remote connectivity of automobiles, combined with the emerging trend to automated driving, the importance of security for automotive systems is massively increasing. Although cyber security is a common part of daily routines in the traditional IT domain, necessary security mechanisms are not yet widely applied in the vehicles. At first glance, this may not appear to be a problem as there are lots of solutions from other domains, which potentially could be re-used. But substantial differences compared to an automotive environment have to be taken into account, drastically reducing the possibilities for simple reuse. Our contribution is to address automotive electronics engineers who are confronted with security requirements. Therefore, it will firstly provide some basic knowledge about IT security and subsequently present a selection of automotive specific security use cases.

The recent improvements in automotive electronics have had a tremendous impact on safety, comfort and emissions. But the continuous increase of the volume of electronic equipment in cars (representing more than 25% of purchasing volume) as well as the increasing system complexity represent a new challenge to quality, post-sales customer support and maintenance. Identifying a fault in a complex network of ECUs, where the different functions are getting more and more intricate, is not an easy task. It can be shown that with the levels of reliability common in 1980, an upper-range automobile of today could never function fault-free. On-Board-Diagnostics (OBD) concepts are emerging to assist the maintenance personnel in localizing the source of a problem with high accuracy, reducing the vehicle repair time, repair costs and costs of warranty claims.

In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.

Vehicle manufacturers are challenged by rising costs for vehicle recalls. A major part of the costs are caused by software updates. This paper describes a feasibility study on how to implement software update over the air (SOTA) in light vehicles. The differences and special challenges in the automotive environment in comparison to the cellular industry will be explained. Three key requirements focus on the drivers’ acceptance and thus are crucial for the vehicle manufacturers: SOTA must be protected against malicious attacks. SOTA shall interfere as little as possible with the availability of a vehicle. Long update processes with long vehicle downtimes or even complete fails must be avoided. The functional safety of the vehicle during operation may not be limited in any way The study gives options how those objectives can be achieved. It considers the necessary security measures and describes the required adaptations of the board-net architectures both on software and hardware level.

This paper explains why software for efficient model-based development is needed to improve the efficiency of automakers and suppliers when implementing solutions with next generation automotive embedded systems. The resulting synergies are an important contribution for the automotive industry to develop safer, smarter, and more eco-friendly cars. To achieve this, it requires implementations of algorithms for machine learning, deep learning and model predictive control within embedded environments. The algorithms’ performance requirements often exceed the capabilities of traditional embedded systems with a homogeneous multicore architecture and, therefore, additional computing resources are introduced. The resulting embedded systems with heterogeneous computing architectures enable a next level of safe and secure real-time performance for innovative use cases in automotive applications such as domain controllers, e-mobility, and advanced driver assistance systems (ADAS).

The current automotive electronic and electrical (EE) architecture has reached a scalability limit and in order to adapt to the new and upcoming requirements, novel automotive EE architectures are currently being investigated to support: a) an Ethernet backbone, b) consolidation of hardware capabilities leading to a centralized architecture from an existing distributed architecture, c) optimization of wiring to reduce cost, and d) adaptation of service-oriented software architectures. These requirements lead to the development of Zonal EE architectures as a possible solution that require appropriate adaptation of used security mechanisms and the corresponding utilized hardware trust anchors. 1 The current architecture approaches (ECU internal and in-vehicle networking) are being pushed to their limits, simultaneously, the current embedded security solutions also seem to reveal their limitations due to an increase in connectivity.

The automotive industry experiences a major change as vehicles are gradually becoming a part of the Internet. Security concepts based on the closed-world assumption cannot be deployed anymore due to a constantly changing adversary model. Automotive Ethernet as future in-vehicle network and a new E/E Architecture have different security requirements than Ethernet known from traditional IT and legacy systems. In order to achieve a high level of security, a new multi-layer approach in the vehicle which responds to special automotive requirements has to be introduced. One essential layer of this holistic security concept is to restrict non-authorized access by the deployment of embedded firewalls. This paper addresses the introduction of automotive firewalls into the next-generation domain architecture with a focus on partitioning of its features in hardware and software.

Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive.

New generation microcontrollers for automotive applications require a huge number of I/Os, dealing with various sensor and actuator signals derived from the external world. In case of the first TriCore™ based 32-Bit microcontroller this leads to approximately 270 I/Os for signal processing. Adding the power supply lines and thermal balls, the overall number of required interconnects grows far over 300. To outperform standard microcontroller packages, e.g. QFPs, the limitations in terms of package size and maximum number of interconnects have to be improved. Main goal is to adapt the component quality to the high level reliability standard, which is the basis of an implementation into automotive parts. Current tests with a P-BGA standard package show interesting results for the board level reliability, when design and test parameters are changed only slightly.

The three major challenges in the power electronics in hybrid and electric vehicles are: System cost, power density and reliability. High temperature power device and packaging technologies increases the power density and reliability while reducing system cost. Advanced Silicon devices with synthesized high-temperature packaging technologies can achieve junction temperature as high as 200C (compared to the present limitation of 150C) eliminating the need for a low-temperature radiator and therefore these devices reduces the system cost. The silicon area needed for a power inverter with high junction temperature capability can be reduced by more than 50 - 75% thereby significantly reducing the packaging space and power device and package cost. Smaller packaging space is highly desired since multiple vehicle platforms can share the same design and therefore reducing the cost further due to economies of scale.

More and more passenger cars are equipped with passive side protection systems such as thorax airbags for front and rear passengers. In the past, side airbag protection systems used sensors based on acceleration measurements [1]. In the meantime different sensor principles have been tested in order to increase the performance of this application. The intention has been to achieve faster firing decisions and to decrease the misuse risk for a floor or chassis impact. This paper presents the partitioning of an advanced chipset for pressure and acceleration based airbag systems. It shows the communication link between the sensors, the receiver-IC and other blocks in the application.

Glare-free high beams are a consistent enhancement of adaptive headlight systems for vehicles with advanced driver assist systems. A prerequisite for these are camera-based systems with the ability to recognize and classify objects such as vehicles in front or oncoming vehicles when driving at night. These objects can then be dynamically masked out of the high beam of the specially designed headlights. Since we are talking about moving objects, it is essential for the high beam to be continuously and dynamically adapted. This paper describes a modular LED matrix system for dynamically adjusting a glare-free and continuously active high beam. The main focus was on the modularity of the system and the optimization of the thermal properties of an LED matrix in order to ensure that operation was reliable under the harsh environmental conditions inside a headlight. Specific control electronics and different interconnection methods were examined.

For the past approximately 20 years, the Serial Peripheral Interface (SPI) has been the established standard for serial communication between a host or central microprocessor and peripheral devices. This standard has been used extensively in control modules covering the entire spectrum of automotive applications, as well as non-automotive applications. As the complexity of engine control modules grows, with the number of vehicle actuators being controlled and monitored increasing, the number of loads the central microprocessor has to manage is growing accordingly. These loads are typically controlled using discrete and pulse-width modulated (PWM) outputs from the microcontroller when real-time operation is essential or via SPI when real-time response is not critical. The increase of already high pin-count on microcontrollers, the associated routing effort and demand for connected power stages is a concern of cost and reliability for future ECU designs.

In modern vehicles, the number of small electrical drive systems is still increasing continuously for blowers, fans and pumps as well as for window lifts, sunroofs and doors. Requirements and operating conditions for such systems varies, hence there are many different solutions available for controlling such motors. In most applications, simple, low-cost DC motors are used. For higher requirements regarding operating time and in stop-start capable systems, the focus turns to highly efficient and durable brushless DC motors with electronic commutation. This paper compares various electronic control concepts from a semiconductor vendor point of view. These concepts include discrete control using relays or MOSFETs. Furthermore integrated motor drivers are discussed, including system-on-chip solutions for specific applications, e.g. specific ICs for window lift motors with LIN interface.

This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).