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Technical Paper

AUDO Architecture A Solution to Automotive Micro-Controller Requirements

2000-03-06
2000-01-0145
The C166 family, based on a 16-bit core; it is nowadays an enormous success in automotive, in particular in PowerTrain. This component is the right answer for the automotive real time applications of today. It is with both, automotive customer requirements and a long automotive experience in semi-conductors that this new generation 32-bit family is borne. The objective of this document is to provide and comment on automotive requirements in terms of the new micro-controller, to show the benefits for the applications and explain how the AUDO architecture fulfils these requirements.
Technical Paper

Advanced Gasoline Engine Management Platform for Euro IV & CHN IV Emission Regulation

2008-06-23
2008-01-1704
The increasingly stringent requirements in relation to emission reduction and onboard diagnostics are pushing the Chinese automotive industry toward more innovative solutions and a rapid increase in electronic control performance. To manage the system complexity the architecture will require being well structure on hardware and software level. The paper introduces GEMS-K1 (Gasoline Engine Management System - Kit 1). GEMS-K1 is a platform being compliant with Euro IV emission regulation for gasoline engines. The application software is developed using modeling language, the code is automatically generated from the model. The driver software has a well defined structure including microcontroller abstraction layer and ECU abstraction layer. The hardware is following design rules to be robust, 100% testable and easy to manufacture. The electronic components use the latest innovation in terms of architecture and technologies.
Technical Paper

Automotive Sensors & Sensor Interfaces

2004-03-08
2004-01-0210
The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems push the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration pass to evolution and even revolution of automotive Sensors and Sensor interfaces. The document will explore different architectures and partitioning. Sensor technologies such as magnetic field sensors based on the hall effect as well as bulk and surface silicon micro machined sensors will be mapped to automotive applications by examples. Functions such as self-test, self-calibration and self-repair will be developed.
Technical Paper

Digital Knock Signal Conditioning using Fast ADC and DSP

2004-03-08
2004-01-0517
The increasing legal requirements for safety, emission reduction, fuel economy and onboard diagnosis systems is pushing the market for more innovative solutions with rapidly increasing complexity. Hence, the embedded systems that will have to control the automobiles have been developed at such an extent that they are now equivalent in scale and complexity to the most sophisticated avionics systems. The former analogue filter design is now replaced by digital signal processing. This paper will demonstrate the key elements to provide a powerful, scalable and configurable solution that offers a migration route to evolve and even revolutionize automotive electronics. To illustrate this migration toward digital processing the knock function has been developed. A simple RC filter is used as external anti-aliasing. To get the maximum flexibility the signal is very early converted and processed digitally. The micro-controller has been developed using a three-layered solution.
Technical Paper

Effective System Development Partitioning

2001-03-05
2001-01-1221
In terms of modern technical systems, the automotive sector is characterized by escalating complexity and functionality requirements. The development of embedded control systems has to meet highest demands regarding process-, time- and cost-optimization. Hence, the efficiency of software development becomes a crucial competitive advantage. Systems design engineers need effective tools and methods to achieve exemplary speed and productivity within the development phase. To obtain such tools and methods, semiconductor manufacturers and tool manufacturers must work closely together. Within the joint efforts of ETAS and Infineon, the software tool suite ASCET-SD was enhanced to generate efficient C code for Infineon's TriCore architecture mapped on ETAS's real-time operating system ERCOSEK. The processor interface to application & calibration tools was realized using the ETK probe based on a JTAG/Nexus link at very high bandwidth.
Technical Paper

Embedded System Tool to Support Debugging, Calibration, Fast Prototyping and Emulation

2004-03-08
2004-01-0304
Infineon's latest high-end automotive microcontrollers like TC1796 are complex Systems On Chip (SoC) with two processor cores and up to two internal multi-master buses. The complex interaction between cores, peripherals and environment provides a big challenge for debugging. For mission critical control like engine management the debugging approach must not be intrusive. The provided solution are dedicated Emulation Devices which are able to deal with several 10 Gbit/s of raw internal trace data with nearly no cost adder for mass production and system design. Calibration, which is used later in the development cycle, has different requirements, but is covered by the Emulation Devices as well. The architecture of TC1796ED comprises the unchanged TC1796 silicon layout, extended by a full In-Circuit Emulator (ICE) and calibration overlay memory on the same die. In most cases, the only debug/calibration tool hardware needed is a USB cable.
Technical Paper

Future Engine Control Enabling Environment Friendly Vehicle

2011-04-12
2011-01-0697
The aim of this paper is to compile the state of the art of engine control and develop scenarios for improvements in a number of applications of engine control where the pace of technology change is at its most marked. The first application is control of downsized engines with enhancement of combustion using direct injection, variable valve actuation and turbo charging. The second application is electrification of the powertrain with its impact on engine control. Various architectures are explored such as micro, mild, full hybrid and range extenders. The third application is exhaust gas after-treatment, with a focus on the trade-off between engine and after-treatment control. The fourth application is implementation of powertrain control systems, hardware, software, methods, and tools. The paper summarizes several examples where the performance depends on the availability of control systems for automotive applications.
Technical Paper

Key Factors in Improving Microcontroller Performance and Features

2006-10-16
2006-21-0006
The increasingly stringent requirements in relation to safety, fuel economy, emission reduction, and onboard diagnostics are pushing the automotive industry toward more innovative solutions and a rapid increase in microcontroller performance. This paper will list the key factors necessary to increase overall data throughput and provide the right features to satisfy the coming drivetrain requirements. The paper will address different aspects such as: microcontroller architecture, cores, memories, silicon technologies, assembly / packaging, and development tools. It will also present techniques to improve modularity, scalability and configurability that will offer a migration path to permit the evolution and even revolution of drivetrain electronics. Since quality and reliability requirements are among the most stringent of any application fields, the paper will outline the path to reach zero-defect products.
Technical Paper

MultiCore Benefits & Challenges for Automotive Applications

2008-04-14
2008-01-0989
This paper will give an overview of multicore in automotive applications, covering the trends, benefits, challenges, and implementation scenarios. The automotive silicon industry has been building multicore and multiprocessor systems for a long time. The reasons for this choice have been: increased performance, safety redundancy, increased I/O & peripheral, access to multiple architectures (performance type e.g. DSP) and technologies. In the past, multiprocessors have been mainly considered as multi-die, multi-package with simple interconnection such as serial or parallel busses with possible shared memories. The new challenge is to implement a multicore, micro-processor that combines two or more independent processors into a single package, often a single integrated circuit (IC). The multicores allow a computing device to exhibit some form of thread-level parallelism (TLP).
Technical Paper

Smart IGBT's for Advanced Distributed Ignition Systems

2004-03-08
2004-01-0518
Driven by factors like consumption, power output per liter, comfort and more stringent exhaust gas standards the powertain control area, has developed rapidly in the last decades. This trend has also brought with it many innovations in the ignition application. Today we can see a trend to Pencil-coil or Plug-top-coil ignition systems. The next step in system partitioning is to remove the power driver from the ECU and place it directly in/on the coil body. The advantages of the new partitioning - e.g. no high voltage wires, reduced power dissipation on the ECU - are paid with different, mainly tougher requirements for the electronic components. By using specialized technologies for the different functions - IGBT for switching the power, SPT for protection, supply and diagnostics - in chip-on-chip technology all required functions for a decentralized ignition system can be realized in a TO220/ TO263 package.
Technical Paper

X-by-Wire: Opportunities, Challenges and Trends

2003-03-03
2003-01-0113
This paper will outline the results of a study performed to analyze the market introduction of x-by-wire applications in the context of weak global industry environment, technological and legislative challenges, standardization issues and end customer benefits. This paper attempts to provide a bird-view on influence factors and impacts for the x-by-wire market, including e.g. the end customer's acceptance and legal environment driving further development in specific areas. Further, major driving forces on semiconductor/component level will be outlined regarding e.g. pin-count, computation performance and heat dissipation, but also possible scenarios and solutions towards safe and efficient system design and partitioning.
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