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More stringent emissions regulations, space limitations for catalytic converters in modern automotive applications, and new engine technologies constitute design challenges for today's engineers. In that context high cell density thinwall and ultrathinwall ceramic substrates have been designed into advanced catalytic converters. Whereas the majority of these substrates have a square cell geometry, a potential for further emissions improvement has been predicted for hexagonal cell structures. In order to verify these predictions, a ceramic substrate has been developed combining the features of high cell density, ultrathin cell walls, and hexagonal cell structure. Based on modeling data, the actual cell density and wall thickness of the hexagonal cell substrate will be defined. The performance of that substrate will be assessed by comparing experimental emissions results using two modern Volkswagen engines.

For substantial reduction of fuel consumption of their vehicle fleet, Volkswagen AG has decided to develop spark-ignition engines with direct fuel injection. To launch this new engine concept with stratified lean operation mode while at the same time meeting the stringent EU IV emission standards, it was necessary to develop a suitable exhaust gas aftertreatment system. This was achieved as part of an intensive co-operation between Volkswagen AG and OMG, formerly dmc2 Degussa Metals Catalysts Cerdec AG. The paper describes the demands for exhaust gas aftertreatment due to lean burn operation. In addition the main development steps of the exhaust gas aftertreatment system for Volkswagen FSI engines and catalyst durability over vehicle lifetime are discussed. Focus is laid on the catalyst system design and coating variations. Volkswagen developed a new closed-loop emission control management system which uses NOx-sensor signals for the first time worldwide.

Driven by the worldwide automotive emission regulations, ceramic substrates were developed to serve as catalyst support. Since the introduction of Standard wall substrates in 1974, substrates with thinner walls and higher cell densities have been developed to meet the tighter emission requirements; Worldwide, the amount of Thinwall and Ultrathinwall substrates in series applications is increasing continuously. The properties of the substrates determine their performance regarding pressure drop, heat-up and conversion efficiency. These properties are analyzed, as well as the packaging process for Thinwall and Ultrathinwall substrates; A new packaging technique with lower pressure load is described.