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AMS2690C - Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates

Details
Document Number: AMS2690C
Revision Number: C
Title
Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates
Scope
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.
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