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AMS3690C - Adhesive Compound, Epoxy, Room Temperature Curing

Details
Document Number: AMS3690C
Revision Number: C
Title
Adhesive Compound, Epoxy, Room Temperature Curing
Scope
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
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