| Details |
| Document Number: |
ARP1612A |
| Revision Number: |
A |
| Title |
| Polyamide Printed Circuit Boards Fabrication Of |
| Scope |
| This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyamide printed wiring boards. Included are recommendations for both double-sided and multi-layer boards. The processes described herein are the result of extensive evaluation and manufacturing experience. These recommendations reflect procedures that have proven effective in producing low-cost and reliable printed wiring boards. |
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