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G-24 Pb-free Risk Management Committee for ADHP

Standards Status Definitions
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Document List
Document Title Date Status
GEIAHB0005_1 Program Management/Systems Engineering Guidelines for Managing the Transition to Lead-Free Electronics Jun 01, 2006 Issued
GEIAHB0005_2 Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and Finishes Nov 01, 2007 Issued
GEIAHB0005_3 Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems Sep 01, 2008 Issued
GEIASTD0005_1A Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder Mar 01, 2012 Revised
GEIASTD0005_2A Standard for Mitigating the Effects of Tin Whishers in Aerospace and High Performance Electronic Systems May 01, 2012 Revised
GEIASTD0005_3A Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes Dec 01, 2012 Revised
GEIASTD0006 Requirements for Using Solder Dip to Replace the Rinish on Electronic Piece Parts Jul 01, 2008 Issued