AIR5711 - HTEP Testing Guide Lines, 2007

Details Not available for purchase at this time. Document Number: AIR5711 Project Initiation: 11-28-2006 Project Number: Revision Number: Sponsor Name: Steven Mark Iden Title HTEP Testing Guide Lines, 2007 Scope The goal of this specification is to help component manufacturers and electronic application designers develop a set of testing guidelines for high-temperature, reliable electronic systems. Rationale The sprit of this document is to provide initial industry testing parameters to: 1. Aid component manufacturers in identifying their components as high-temperature and reliable. 2. Aid system designers with a strong starting source of electronic components and sensors to reduce in-house qualifying and reduce development risks. 3. Aid end-users identifying systems built from manufacturer qualified components and sensors, assuring increased operating life and reliability. 4. To keep testing and documentation simple and easy to understand in order for the end consumer to see the benefits of components and systems meeting the listed requirements within this document. This document is not intended to be an application specification but a means to facilitate the evolution of a high-temperature electronics industry benefiting a large number of industrial applications including automotive, aerospace, deep drilling and electrical power grid. This document was written for consideration of new high-temperature components and not for manufacturer ongoing production testing.

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