AMS3684C - Resin, Polyimide, Sealing High-Temperature Resistant, 315Mdc (600Mdf) Unfilled

Details Not available for purchase at this time. Document Number: AMS3684C Project Initiation: 07-02-2004 Project Number: Revision Number: C Sponsor Name: Title Resin, Polyimide, Sealing High-Temperature Resistant, 315Mdc (600Mdf) Unfilled Scope This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure. Rationale Rationale Not available

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