AMS3731/2D - Potting Compound, Epoxy, Bisphenol A-Type, Filled, Heat Cure, Low Cte, Thermal Shock Resistant

Details Not available for purchase at this time. Document Number: AMS3731/2D Project Initiation: 04-16-2012 Project Number: Revision Number: D Sponsor Name: Alan Fletcher Title Potting Compound, Epoxy, Bisphenol A-Type, Filled, Heat Cure, Low Cte, Thermal Shock Resistant Scope This specificiation covers a filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties. Rationale Cancel due to inaccurate technical requirements.

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