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AS6171/III - Delid/Decapsulation Physical Analysis (DDPA) for Counterfeit Part Detection

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Document Number: AS6171/III
Project Initiation: 04-02-2013
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Sponsor Name: Erik Jordan
Delid/Decapsulation Physical Analysis (DDPA) for Counterfeit Part Detection
This method standardizes inspection and test procedures and minimum training and certification requirements to detect Suspect, Fraudulent, & Counterfeit (SFC) Electrical, Electronic, and Electromechanical (EEE) components or parts utilizing Delid/Decapsulation Physical Analysis. The requirements of this document are employed to either delid or remove the cover from a hermetically sealed package or to remove the outer protective coating or encapsulation of an EEE Part, in order to examine the internal structure to determine if the part appears authentic. Information derived may be used to: a. preclude installation of inauthentic parts or parts having obvious or latent defects b. aid in disposition of parts that exhibit anomalies c. aid in defining improvements or changes in design, materials, or processes d. evaluate Supplier production trends. NOTE: This test method should not be confused with Destructive Physical Analysis as defined in MIL-STD-1580.
The purpose of this document is to provide guidelines and requirements associated with the use of decapsulation, disassembly, and internal inspection as part of the process to authenticate the identity of the manufacturer of a part, and/or to discern and document characteristics that are consistent with counterfeit parts.
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