Micromachined Heat Sinks

Document Number: 1999-01-1408

Date Published: April 1999

Author(s):
Christopher Bang - Advanced MicroMachines, Inc.
Tao Pan - Advanced MicroMachines, Inc.

Abstract:
A silicon micromachined heat sink is presented. The device uses liquid cooling in microchannels to remove high heat fluxes. Deep reactive ion etching and multiple wafer bonding is employed to fabricate high aspect ratio, enhanced heat transfer surfaces and a flow channel network that enhances cooling efficiency and minimizes the pressure drop across the device. Experimental test results are presented. Tests to date indicate that up to 76.5 W/cm\u2 may be removed by the heat sink based on a 100\mDC electronic device temperature.

File Size: 574K
Product Status: In Stock

See other papers presented at Aerospace Power Systems Conference, April 1999, Mesa, AZ, USA, Session: Application of Micro Systems in Aerospace Vehicle Power Systems

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