Evaluation of Cooling Concepts for High Power Avionics Applications

Document Number: 921942

Date Published: October 1992

Author(s):
E. M. Flynn - McDonnell Douglas Corp.

Abstract:
Evaluations were made of emerging cooling technologies having potential to remove 100 W/sq. cm steady state heat dissipation while holding chip junction temperature to 90\mDC. Several constraints were imposed on the cooler due to the intended application of cooling fighter aircraft electronics. Constraints included a practical lower limit on coolant supply temperature, the preference or a nontoxic, nonflammable, and nonfreezing coolant, the need to minimize weight and volume, and operation in an accelerating environment. Evaluation factors included aircraft system impact, cooler development status, reliability and maintainability, safety, etc. This paper describes the cooling concepts, and assessment made as to their relative performance in a fighter aircraft environment.

File Size: 1436K
Product Status: In Stock

See other papers presented at Aerotech Conference & Exposition, September 1992, Long Beach, CA, USA, Session: Aerotech Conference & Exposition

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