Nano Dimension creates the first printed circuit boards with side-mounted features
(Image courtesy: Nano Dimension Ltd.)

Nano Dimension creates the first printed circuit boards with side-mounted features

Israel’s Nano Dimension has developed a novel technique for side-mounting technology on additively manufactured circuit boards. This new capability has the potential to increased circuit board capabilities in microelectromechanical systems (MEMS) and miniature satellites.

Nano Dimension Ltd., an additive electronics provider based in Ness Ziona, Israel, has developed the world’s first side-mounting technology for printed circuit boards (PCBs) produced through additive manufacturing (AM) or “3D-printing.” The side mounted designs allow for more functionality on circuit boards, which will impact Internet of Things (IoT) and Industry 4.0 applications where customized designs and shapes are a growing demand.

Using its DragonFly Pro precision AM system, Nano Dimension printed and soldered components to the top, bottom, and sides of PCBs. The novel technique has resulted in as much as a 50 percent increase in board space when compared with traditionally manufactured PCBs.

 

 

The capability to produce multidimensional PCBs comes shortly after Nano Dimension received patent approval for its dielectric ink in the United States and South Korea. Dielectric ink has been shown to provide excellent performance for high frequency communications up to 6GHz, with circuit performance comparable to that of circuits developed using conventional manufacturing techniques.

 

Read the full article in the Advanced Manufacturing Knowledge Hub.

 

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William Kucinski is content editor at SAE International, Aerospace Products Group in Warrendale, Pa. Previously, he worked as a writer at the NASA Safety Center in Cleveland, Ohio and was responsible for writing the agency’s System Failure Case Studies. His interests include literally anything that has to do with space, past and present military aircraft, and propulsion technology.

Contact him regarding any article or collaboration ideas by e-mail at william.kucinski@sae.org.

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