AGI and ANSYS partner to integrate next-gen digital modeling into engineering design

ANSYS – through a new partnership with global mission simulation leader, Analytical Graphics, Inc. (AGI) – has begun integrating mission analysis into its engineering design process. The work is expected to enable satellite, aerospace, and defense customers to create more precise and reliable modeling and mission simulations with greater accuracy for complex scenarios.

Currently, systems engineers leverage parametric or reduced-order models to build out large-scale mission and system simulations that incorporate electronic, fluid, and mechanical components. But next-generation physics-based modeling can be used to create component models with improved fidelity, precision, and dependability to enable more sophisticated levels of simulation and systems-of-systems simulation. This approach can be applied to situations like aircraft missions that are conducted in contested airspace and satellites orbiting the Earth.

AGI and ANSYS are streamlining processes and interfaces by incorporating highly accurate, ANSYS-generated engineering physics component models within complete, large-scale mission simulation scenarios in AGI's multi-domain mission analysis software, Systems Tool Kit (STK).


Read the full article in the Advanced Manufacturing Knowledge Hub.


Learn more

  • Bookmark to keep pace with the latest aerospace technology news and information.

  • Subscribe to SAE MOBILUS for access to more than 200,000 resources, including aerospace standards, technical papers, eBooks, magazines, and video.


William Kucinski is content editor at SAE International, Aerospace Products Group in Warrendale, Pa. Previously, he worked as a writer at the NASA Safety Center in Cleveland, Ohio and was responsible for writing the agency’s System Failure Case Studies. His interests include literally anything that has to do with space, past and present military aircraft, and propulsion technology.

Contact him regarding any article or collaboration ideas by e-mail at

Continue reading »