The IBIS Open Forum Releases the IBIS Version 7.0 Specification with Enhanced Modeling for Serial Links and Electronic Package and IC Die Interconnections

The IBIS Open Forum has approved Version 7.0 of IBIS (I/O Buffer Information Specification). IC developers will now be able to supply behavioral I/O models representing package and on-die interconnect on very high speed digital ICs using Touchstone and IBIS-ISS (IBIS Interconnect Spice Subcircuits). Also new to IBIS is "back-channel" link training protocol support in IBIS-AMI serial link models. With version 7.0 IBIS-AMI models, the time domain training sequence of SerDes buffers implementing automated dynamic link training can be simulated. The feature also allows models for “static” SerDes buffer designs to help system designers by automating the search for optimum buffer control settings. The new IBIS includes a number of other improvements, offering a significant upgrade to IBIS version 6.1.
IBIS Open Forum Chair Mike LaBonte commented on the enhanced interconnect modeling feature, saying: “For the first time, IBIS recognizes the need to use separate extraction tools for the on-die and package portions of chip interconnect, with a standardized format allowing the two to be easily joined into a comprehensive interconnect model for signal integrity analysis.”  The new IBIS file syntax also makes possible more advanced models for power integrity using the popular IBIS format. IBIS files are widely available for digital ICs.
The new specification was approved on March 15, 2019 and is available at . Official parser software will be made available for checking IBIS files for version 7.0 syntax conformity.
For more information about the IBIS Open Forum, please visit: or contact

The IBIS Open Forum ( is an SAE ITC (Industry Technologies Consortia) program ( The SAE ITC team specializes in establishing and managing consortia by providing proven processes, tools and resources. ITC enables public, private, academic and government organizations to connect and collaborate in neutral, pre-competitive forums thus empowering the setting and implementation of strategic business improvements in highly engineered industries globally.

SAE ITC is an affiliate of SAE International. SAE International is a global association committed to advancing mobility knowledge and solutions for the benefit of humanity. By engaging nearly 200,000 engineers, technical experts and volunteers, we connect and educate mobility professionals to enable safe, clean, and accessible mobility solutions. We act on two priorities: encouraging a lifetime of learning for mobility engineering professionals and setting the standards for industry engineering. We strive for a better world through the work of our philanthropic SAE Foundation, including programs award-winning programs like A World in Motion® and the Collegiate Design Series™.

The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of the U.S. Government.
  Continue reading »