The IBIS Open Forum Releases the IBIS Version 7.0 Specification with Enhanced Modeling for Serial Links and Electronic Package and IC Die Interconnections
The IBIS Open Forum has approved Version 7.0 of IBIS (I/O Buffer Information Specification). IC developers will now be able to supply behavioral I/O models representing package and on-die interconnect on very high speed digital ICs using Touchstone and IBIS-ISS (IBIS Interconnect Spice Subcircuits). Also new to IBIS is "back-channel" link training protocol support in IBIS-AMI serial link models. With version 7.0 IBIS-AMI models, the time domain training sequence of SerDes buffers implementing automated dynamic link training can be simulated. The feature also allows models for “static” SerDes buffer designs to help system designers by automating the search for optimum buffer control settings. The new IBIS includes a number of other improvements, offering a significant upgrade to IBIS version 6.1.
IBIS Open Forum Chair Mike LaBonte commented on the enhanced interconnect modeling feature, saying: “For the first time, IBIS recognizes the need to use separate extraction tools for the on-die and package portions of chip interconnect, with a standardized format allowing the two to be easily joined into a comprehensive interconnect model for signal integrity analysis.” The new IBIS file syntax also makes possible more advanced models for power integrity using the popular IBIS format. IBIS files are widely available for digital ICs.
The new specification was approved on March 15, 2019 and is available at https://ibis.org/ver7.0/ . Official parser software will be made available for checking IBIS files for version 7.0 syntax conformity.
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