Microelectronics Failure Analysis, Sixth Ed. B-ASM-035

This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.

Topics include:

• Failure Analysis Process Flow
• Failure Verification
• Failure Modes and Failure Classification
• Special Devices (MEMS, Optoelectronics, Passives)
• Fault Localization Techniques: Package Level (NDT)
• Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)
• Deprocessing & Imaging Techniques: Deprocessing
• General Imaging Techniques
• Local Deprocessing & Imaging
• Circuit Edit and Design Modification
• Material Analysis Techniques
• Reference Information: Important Topics for Semiconductor Devices
• Failure Analysis Techniques Roadmap
• Failure Analysis Operations and Management
• Appendices: Failure Analysis Terms, Definitions, and Acronyms
• Industry Standards