Browse Publications Technical Papers 1999-01-0161

Integrated Mold Technology for Semiconductor Device 1999-01-0161

Recently, automotive semiconductor devices need miniaturization. One of the most important technologies is the package which encapsulates devices. In addition, the outer shape of the package is needed to change according to the mounted space. Conventional devices are mounted in the case, and encapsulated with potting resin. However this package structure is difficult to miniaturize because the case size limit. This report describes the development of the packaging technology for miniature and particular outer shape. The devices are set in the cavity and molded to one package. The three-dimension flow simulation is applied to analyze the flow in the cavity. The results of simulation correspond with experimental results. The cavity structure and the mold resin can be optimized by the simulation.


Subscribers can view annotate, and download all of SAE's content. Learn More »


Members save up to 43% off list price.
Login to see discount.
Special Offer: Purchase more aerospace standards and aerospace material specifications and save! AeroPaks off a customized subscription plan that lets you pay for just the documents that you need, when you need them.