Browse Publications Technical Papers 2000-01-3621

Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability 2000-01-3621

A miniature heat pipe constructed from a multi-layered, co-fired ceramic process utilizing brazed-on evaporator and condenser slugs is investigated. The substrate-embedded heat pipe is shown to effectively dissipate the heat generated by a power MOSFET, used as the heat source, while maintaining a nearly constant junction temperature over a power load range from 6 to 10 watts. Independent modeling of the evaporation, vapor flow, condensation, and capillary flow are used to guide the heat pipe development. Predicted operation and experimental operation of the heat pipe are compared.


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