Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability 2000-01-3621
A miniature heat pipe constructed from a multi-layered, co-fired ceramic process utilizing brazed-on evaporator and condenser slugs is investigated. The substrate-embedded heat pipe is shown to effectively dissipate the heat generated by a power MOSFET, used as the heat source, while maintaining a nearly constant junction temperature over a power load range from 6 to 10 watts. Independent modeling of the evaporation, vapor flow, condensation, and capillary flow are used to guide the heat pipe development. Predicted operation and experimental operation of the heat pipe are compared.
Citation: Snyder, S., Newton, C., and Lange, M., "Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability," SAE Technical Paper 2000-01-3621, 2000, https://doi.org/10.4271/2000-01-3621. Download Citation
Steven R. Snyder, C. Michael Newton, Michael Lange
Power Systems Conference
Proceedings of the SAE Power Systems Conference 2000-P-359, SAE 2000 Transactions Journal of Aerospace-V109-1