New, High Efficiency, Low Cost Liquid Heat Exchanger for Cooling Power Semiconductor Devices 2001-01-1743
A novel extruded aluminum heat exchanger for cooling power semiconductor devices used in hybrid vehicles is described. The patented and patent pending design employs an enhanced heat transfer surface and turbulence generating devices to efficiently remove heat from devices, such as IGBTs, and reject it into the vehicles coolant loop. Heat transfer rates approach brazed plate-fin designs while the pressure drop remains low at high coolant flow.
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