Mechanical Behaviour of Sn-Pb and Sn-Ag Soldering Alloys for Printed Circuit Boards of the Automotive Industry 2001-01-3220
In the present work, a comparative study of the constitutive equations describing the flow behaviour at relatively high homologous temperatures of eutectic tin-lead and tin-silver alloys is carried out. For this purpose uniaxial compression tests were performed on the latter two alloys at diverse strain rates and temperatures. Results showed that at relatively low temperatures the deformation response can be considered to be controlled by the same mechanism. However, the tin-lead eutectic, displayed superplastic behaviour at high temperatures.
Citation: Cabrera, J., Prado, J., Subirats, A., and Cubero, J., "Mechanical Behaviour of Sn-Pb and Sn-Ag Soldering Alloys for Printed Circuit Boards of the Automotive Industry," SAE Technical Paper 2001-01-3220, 2001, https://doi.org/10.4271/2001-01-3220. Download Citation
J. M. Cabrera, J. M. Prado, A. Subirats, J. A. Cubero
Departamento de Ciencia de los Materiales e Ingeniería Metalúrgica Centre Tecnològic de Manresa Universitat Politécnica de Catalunya, Lear Automotive, European Technological Center
Automotive and Transportation Technology Congress and Exposition
ATTCE 2001 Proceedings Volume 4 - Materials-P-370