Comparison of Thermal Performance of Different Power Electronic Stack Constructions

Kanghua Chen; Sayeed Ahmed; Doug Maly; Scott Parkhill; Fred Flett

doi:10.4271/2002-01-1917

2002-06-03

Comparison of Thermal Performance of Different Power Electronic Stack Constructions 2002-01-1917

IGBT (Insulated Gate Bipolar Transistor) power modules are of great importance in the development of Electrical Vehicles (including Fuel Cell Vehicles) and Hybrid Electrical Vehicles. The effective thermal management of power modules requires the optimized system configuration of both power modules and coldplates/heatsinks. In this paper, three different stack constructions of IGBT power modules are proposed and their thermal performance is studied using 3-D finite element simulations. The thermal resistance and temperature distribution under both isothermal and convectional (liquid cooled) boundary conditions are carefully calculated and compared. The advantage and disadvantage for each of three stack constructions are discussed and presented.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Digital $35.00 Print $35.00

Preview Document

We also recommend:

Standards

SAE Mobilus®

Publications

News

Events

Professional Development

A World in Motion (PreK-12)

Participate with SAE

SAE Membership

Donate

Comparison of Thermal Performance of Different Power Electronic Stack Constructions 2002-01-1917

SAE MOBILUS