Browse Publications Technical Papers 2004-01-1113

A Silicon Micromachined Gyroscope and Accelerometer for Vehicle Stability Control System 2004-01-1113

A silicon micromachined gyroscope (angular rate sensor, yaw rate sensor) and accelerometer for vehicle stability control system is presented. The 5.1mm×4.7mm sensor chip is fabricated with a silicon micromachining process using a SOI (Silicon on Insulator) silicon wafer and a deep reactive ion etching. The sensor chip has a pair of resonators which are mechanically coupled and function as a tuning fork. The resonators are driven by electrostatic force and their movements are detected by capacitively sensing angstrom displacements. This sensor chip works not only as a gyroscope but also as an accelerometer with a single sensor chip.
The sensor unit consists of the sensor chip above, a signal processing IC, a microcomputer and an EEPROM. sigma-delta analog-to-digital conversion (sigma-delta ADC) is adopted to realize the digital calibration of sensor properties. Sigma-delta modulators on the signal processing IC convert the analog signals of angular rate, acceleration and temperature into oversampled 1-bit digital data. These data are transmitted to the microcomputer and converted into high-resolution, multi-bit digital data through the process of digital decimation filter. Sensor variation is calibrated by the microcomputer with the calibration data which has been stored in the EEPROM.


Subscribers can view annotate, and download all of SAE's content. Learn More »


Members save up to 40% off list price.
Login to see discount.
Special Offer: With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.