Comparing Substrate Solutions for Automotive Power Electronics Applications 2004-01-1681
High power electronic applications in the automotive industry require interconnecting substrates that have high reliability, high thermal conductivity, high current capability, multi-layer potential, and small size. This paper addresses the design requirements for automotive power substrates and how ever increasing demands are challenging the current substrate technology. Four different substrate material types, with various design features, capable of meeting these stringent requirements are described. Thermal impedance testing of each substrate along with design variations to enhance thermal capability was completed. The results of the thermal testing are compared based on appropriate application of the substrate technology.