Browse Publications Technical Papers 2005-01-3058
2005-07-11

A Tool for Thermal Analysis of Electronic Boards with Multiple Heat Sources and Sinks 2005-01-3058

A tool for performing the thermal analysis of circuit printed boards is presented. The dissipative components are considered as rectangular heat sources having certain thermal resistance for coupling to the board. The board is fixed by a frame, which provides conditions for heat output (heat sinks), defined by contact thermal resistances. Additionally, a side heat transfer under the assumption of linearity is considered.
The core algorithm is based on the analytical steady-state solution obtained by the technique of integral transforms. As the results, the temperatures of all components and the 2D temperature maps over the board are computed out without introducing a numerical grid.
The tool is written in FORTRAN 77; the input-output data are text files, whose format is adopted for using spreadsheets like EXCEL, as well as available software for 1D and 2D plotting.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 18% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
TECHNICAL PAPER

A Multi-Level Approach for the Validation of a Tractor-Semitrailer Ride and Handling Model

2004-01-2694

View Details

TECHNICAL PAPER

Robust Automated Airbag Module Calibration

2001-01-0159

View Details

TECHNICAL PAPER

Reduction of the Aerodynamic Drag Due to Cooling Systems: An Analytical and Experimental Approach

2005-01-1017

View Details

X