Browse Publications Technical Papers 2007-01-4220
2007-10-30

Direct Bonding of a Multi-Layer Circuit Substrate to a Heatsink 2007-01-4220

Phoenix International, the electronics manufacturing group of John Deere, has developed a product and manufacturing process to address many of the shortcomings of conventional heatsinking technologies. In this process, a thin circuit board is bonded directly to a flat surface heatsink such as a finned extrusion or liquid-cooled plate. The major benefits of the proposed solution are the simplification of the manufacturing process and substantially improved conduction of heat away from high-power circuitry.

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