Methodology for IP Module Design using Tests and CAE 2008-01-0870
This paper presents a new methodology for instrument panel (IP) design using experimentation and Computer Aided Engineering (CAE). For the cost-reducing and lighter-weight parts using less material, the thickness of IP substrates must be decreased. This study describes IP substrates characterization under thin-wall molding conditions wherein the effects of processing on mechanical properties are explored. The residual stress of IP substrates made by Injection molding is evaluated by a hole drilling method. A Key Life test shows a close correlation between residual stress and IP deformity caused by sun-loading and also verifies durability. To achieve a good performance during car crash testing, several parts of the IP module are optimized by CAE. To decrease the amount of simulated and crash tests, this study can select the main factors of crashed IP by Analysis of Variance (ANOVA); significant (p<0.05) main effect for test was observed. Response Surface Method can also be used to further optimize IP structures. Best combination of design parameters for minimum injury result is selected using Response Surface Method. The results of statistical analysis are discussed in detail in this paper.