Browse Publications Technical Papers 2008-01-2892
2008-11-11

250 °C SiC Power Module Package Design 2008-01-2892

In order to take full advantage of SiC, a high temperature package for power module using SiC devices was designed, developed, fabricated and tested. The details of the material selection and fabrication process are described. High temperature reliability test and power test shows that the package presented in this paper can perform well at the high junction temperature.

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