Avoiding Electrical Overstress for Automotive Semiconductors by New Connecting Concepts 2009-01-0294
Bosch Automotive Semiconductor Unit investigated destroyed semiconductor devices (ASIC) from electronic control unit complaints, which failed due to electrical overstress. It turned out that failure fingerprints could only be reproduced by semiconductor operation far beyond spec limits. One main failure mechanism is caused by hot plugging and bad or late ground connection. In today’s cars some applications are still active for minutes after ignition switch off. So, currents of several amps are delivered and in a typical production or garage environment, hot plugging cannot be avoided completely. Bosch suggests introducing extended ground pins to get an enforced switch on/off sequence during plugging. This poka yoke protection principle is successfully used in other industries for a long time and should now come into cars.