Browse Publications Technical Papers 2009-01-2454

NODE 3 & CUPOLA Thermal Analysis Campaign for Design Verification and Operations Definition 2009-01-2454

In the frame of the International Space Station (ISS) development plan, TAS-I was in charge of manufacturing, integrating and testing several manned modules like American USOS MPLMs, Nodes 2, Node 3 and Cupola in addition to the European manned modules Columbus and ATV.
Based on the current ISS assembly sequence, Cupola, which is considered a US Governed Furnished Equipment (GFE) of Node 3, will be launched mated to the Node 3 active axial port in the NSTS 20A mission, beginning 2010. After NSTS docking and Node 3/Cupola berthing to N1 Port port, Cupola will be moved and permanently located to the N3 Nadir port to support ISS operations (e.g. Japanese HTV docking maneuvers to N2). Thermal design for Cupola consists of passive protections from launch up to its permanent location and active/passive controls when permanently mated to N3.
NASA/ESA requested TAS-I to re-study and re-qualify the Cupola thermal design after a relocation and clocking of the Node 3 (from N1 Nadir Port to N1 Port port) to withstand a new launch scenario (Cupola was conceived to be launched stand-alone) and new flight attitudes.
Scope of this paper is to present the analyses being performed by TAS-I to verify the TCS design for Cupola in temporary and permanent locations and show detailed results of humidity and temperature control for Cupola areas associated to Node 3 sinks in terms of air temperature, cabin dew point and water cooling.
All aspects related to the 7 four-pane Cupola windows, in partially or fully open/closed configurations (each window is equipped with thermal/anti-debris shutters), will be matter of this presentation as well, with the intent to highlight when (or if) condensation or over-temperature can occur inside Cupola habitable volumes (structures, skirts, rings and windows) and properly present solutions to prevent crew squawks or discomfort and minimize any safety risk during operative events.


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