Browse Publications Technical Papers 2011-01-2620
2011-10-18

Development of a High Temperature Power Module Technology with SiC Devices for High Density Power Electronics 2011-01-2620

This paper presents the development of a high density packaging technology for wide band gap power devices, such as silicon carbide (SiC). These devices are interesting candidates for the next aircraft power electronic converters. Effectively they achieve high switching frequencies thanks to the low losses level. High switching frequencies lead to reduce the passive components size and to an overall weight reduction of power converters.
Moreover, SiC devices may enable operation at junction temperatures around 250°C. The cooling requirement is much less stringent than for usual Si devices. This might considerably simplify the cooling system, and reduce the overall weight.
To achieve the integration requirements for SiC devices, classical wire bonding interconnection is replaced by a stacked packaging using bump interconnection technologies, called sandwich. These technologies offer two thermal paths to drain heat out and present more power integration possibilities.
To make reliable sandwich packaging, high temperature solder alloys using low temperature processes are evaluated. Among these assembly techniques, there are the Transient Liquid Phase bonding with Au-Sn solder alloy and the nanopaste silver sintering technique. These techniques are studied as solder assembly solutions to ensure the die-attach and the bumps interconnects.
Therefore, the thermo-mechanical behavior of sandwich packaging using silver sintering process and various bump configurations were evaluated under a thermal cycling profile between -40°C and +185°C by means of numerical simulation. Finally, the design optimization of these high temperature packaging technologies is pointed out.

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