Browse Publications Technical Papers 2012-01-2210

High-Temperature, Distributed Control using Custom CMOS ASICs 2012-01-2210

Four application specific integrated circuits (ASICs) which provide sensing, actuation, and power conversion capabilities for distributed control in a high-temperature (over 200°C) environment are presented. Patented circuit design techniques facilitate fabrication in a conventional, low-cost, 0.5 micron bulk Complimentary Metal Oxide Semiconductor (CMOS) foundry process. The four ASICs are combined with a Digital Signal Processor (DSP) to create a distributed control node. The design and performance over temperature of the control system is discussed. Various applications of the control system are proposed. The authors also discuss various design techniques used to achieve high reliability and long life.


Subscribers can view annotate, and download all of SAE's content. Learn More »


Members save up to 40% off list price.
Login to see discount.
Special Offer: With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.