Browse Publications Technical Papers 2013-26-0075

Enhancement of Cu with Addition of CNT for its Electro Thermal Properties Using Electro Plating Techniques 2013-26-0075

As we all know the price of Cu alloy keep on increasing trend and in few products like motors, generators and power electronics. Cu price plays a vital role in determining the cost. Particularly in power electronics products for the hybrid electric vehicles the electrical/thermal conductivity property of Cu alloy needs to be enhanced since of high voltage requirement within a small space. Many research activities are ongoing to enhance the properties of Cu metal by addition of various alloys compositions. In addition to that the extra-ordinary properties of Carbon Nanotube (CNT) in Metal Matrix Composite (MMC) were main focus for science and technology. Few successful attempts have been made for Copper-Carbon nanotube (Cu-CNT) composites by powder metallurgy techniques, also it was reported the issues on the detoriation of the CNT's properties due to mechanical working. We employed electroplating method to prepare Cu-CNT composites wherein no mechanical working done on CNT, also the homogenous dispersion of CNT made on the Cu metal surfaces. For this study we used Cu (CuETP) in strip form of 2 × 8 mm with chemical composition as C ≥ 99.90%, O = 0.005 - 0.040% and MWCNT with 3 μm - 10 μm length, 4 nm - 12 nm in diameter and 95% purity. The electroplating bath solution, to measure deposition thickness 6 μm - 8 μm the processing parameters were altered. The plated samples then studied using HRSEM/EDAX data's for the microstructure and content compositions. Four probe method was used for measurement of electrical resistivity. The studies reveal that the CNT deposition on the surfaces of the Cu was homogenous dispersion; the resistivity measurement shows the reducing trend as the % of CNT/l of solution is varied. This is a good sign of improvement in the electrical conductivity. Further the sample was studied for corrosion resistance under salt water for its bonding strength on the metal.


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