Browse Publications Technical Papers 2015-01-2556

A New Platform to Study the Correlation between Aging and SEE Sensitivity for the Reliability of Deep SubMicron Electronics Devices 2015-01-2556

The changes brought by the increasing integration density and the new technological trends have pushed the reliability at its limit. Safety analysis for critical system such as embedded electronics for avionics systems needs to take into account these changes. In this paper, we present the consequences on the deep sub-micron (DSM) CMOS devices concerning their single event effect (SEE) sensitivity. We also propose a new modeling method in order to address these issues.


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