1968-02-01

Laser Welding of Microcircuit Interconnections - Simultaneous Multiple Bonds of Aluminum to Kovar 680802

The development of a laser welder to produce multiple welds/laser pulse for use in a flip-chip process is described. Using a glass laser with a blocking mask to split the laser beam into a multiplicity of spots, the simultaneous welding of all 14 interconnect points between an aluminum interconnect pattern on a glass substrate and an unplated Kovar lead frame is possible, weld shear strength of from 800 – 1200 grams in eight-spot samples was achieved in an experimental system.

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