1969-02-01

DISCRETE ASSEMBLIES VS. THICK FILM IC’s 690013

Thick Film is an old technology that is finding new applications. Many of the future integrated circuits for the automotive industry will employ Thick Film Technology. It offers an easy transition from discrete component assemblies, while providing lower overall costs and improved reliability.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 43% off list price.
Login to see discount.
Special Offer: Purchase more aerospace standards and aerospace material specifications and save! AeroPaks off a customized subscription plan that lets you pay for just the documents that you need, when you need them.
X