SAE Mobilus®
0
Cart
Log In
Create Account
Log In
Standards
Standards
Browse Standards
Standards Development
Standards Works
SAE MOBILUS®
Learn More
Log In
Publications
Publications
Browse Publications
Subscriptions
Collections
Journals
Books
Magazines
Technical Papers
News
News
Latest News
Press Room
Videos
Webcasts
Attend
Events
SAE Events
Collegiate Design Series
Learn
Professional Development
Browse Courses
Certifications
Corporate Learning
SAE Learning Center
A World in Motion (K-12)
Overview
Browse Curriculum
Teachers
Volunteers
Special Initiatives
Participate
Membership
Membership Details
Renew
Upgrade
Benefits
Sections
Collegiate Chapters
Fellows
Participate with SAE
Volunteer
Author
Scholarships
Awards
Careers
Brand Gear Store
Donate
Donate
Donate to SAE
SAE Foundation
Search All
Browse
Publications
Technical Papers
710797
1971-02-01
Fabrication of Multilayer Ceramic Interconnection Boards
710797
The basic procedure for fabricating ceramic multilayer boards, for use with beam lead, flip chip, or flying lead semi-conductor devices is described.
DOI:
https://doi.org/10.4271/710797
Citation:
Kasten, E., "Fabrication of Multilayer Ceramic Interconnection Boards," SAE Technical Paper 710797, 1971,
https://doi.org/10.4271/710797
.
Download Citation
Author(s):
Elliott A. Kasten
Pages:
11
Event:
National Aeronautical and Space Engineering and Manufacturing Meeting
Related Topics:
Ceramics
Fabrication
Semiconductors
SAE MOBILUS
Subscribers can view annotate, and download all of SAE's content.
Learn More »
Access SAE MOBILUS »
Digital
$28.00
Print
$28.00
Preview Document
Add to Cart
Members save up to
43%
off list price.
Login
to see discount.
Special Offer:
With TechSelect, you decide what SAE Technical Papers you need, when you need them, and how much you want to pay.
X
