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Technical Papers
710797
1971-02-01
Fabrication of Multilayer Ceramic Interconnection Boards
710797
The basic procedure for fabricating ceramic multilayer boards, for use with beam lead, flip chip, or flying lead semi-conductor devices is described.
DOI:
https://doi.org/10.4271/710797
Citation:
Kasten, E., "Fabrication of Multilayer Ceramic Interconnection Boards," SAE Technical Paper 710797, 1971,
https://doi.org/10.4271/710797
.
Download Citation
Author(s):
Elliott A. Kasten
Pages:
11
Event:
National Aeronautical and Space Engineering and Manufacturing Meeting
ISSN:
0148-7191
e-ISSN:
2688-3627
Related Topics:
Ceramics
Fabrication
Semiconductors
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