1973-02-01

Ion Plating 730545

Ion plating is a high-energy or plasma deposition method which essentially consists of sputtering and ion implantation (thermal evaporation with ionization). During ion plating, deposition is by ions as opposed to atoms. Ion plating has the two distinct characteristics of high throwing power and high kinetic energy. The high throwing power is responsible for coating complex geometrical surfaces with a uniform film without rotation. The high kinetic energy of the ion flux forms a graded interface; as a result a very adherent film is formed. Mechanical tests (tensile, fatigue, and friction) show a very strong adherence of the film and even an increase in mechanical properties such as tensile strength and fatigue life.

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