1977-02-01

Reliability Considerations in the Use of Integrated Circuit Packaging Systems in an Automotive Environment 770229

An overview is presented of integrated circuit technologies, complexities, packaging systems, random infant mortality and wearout failure mechanisms, and automotive environments. Focus is brought to bear on reliability considerations in the use of integrated circuit packaging systems, with special emphasis on the wearout failure mechanisms of plastic versus hermetic packaging systems in automotive environments.

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