Browse Publications Technical Papers 780925
1978-02-01

Corrosion in Integrated Electronics 780925

A review of corrosion mechanisms in integrated electronics is presented. For metallization corrosion to occur, moisture and impurities such as Na, K or Cl must he present to form an electrolytic cell. The aluminum metallization of Integrated Circuits must be protected from the environment to prevent corrosion from occurring. Thick Film Hybrid circuits, besides being susceptable to IC corrosion mechanisms, also can fail due to dendrite formation causing shorting between gold or silver conductors that are exposed to moisture and halogen impurities.

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Add to Cart
Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
We also recommend:
MAGAZINE

Automotive Engineering: September 2021

21AUTP09

View Details

STANDARD

SPLINE WRENCHING SYSTEM, EXTERNAL, METRIC FASTENERS, PERFORMANCE REQUIREMENTS FOR,

MA1549A

View Details

STANDARD

CONNECTOR ACCESSORIES, ELECTRICAL, TERMINATION, SHIELD SPLIT SUPPORT RING, COMPOSITE, NONENVIRONMENTAL, STRAIGHT, CATEGORY 7

AS85049/93C

View Details

X